News & Events
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Chiplet Technology Goes Mainstream as Industry Consortium Finalizes UCIe 2.0 Standard
The Universal Chiplet Interconnect Express (UCIe) Consortium has released version 2.0 of its open standard, enabling seamless integration of chiplets from multiple vendors. With support from AMD, Intel, TSMC, Samsung, and Arm, the update promises higher bandwidth, lower power, and broader adoption across data center, automotive, and consumer electronics markets.
TSMC Accelerates Arizona Fab Ramp-Up Amid Surging AI Chip Demand
Taiwan Semiconductor Manufacturing Company (TSMC) has fast-tracked production at its second Arizona fab, now targeting volume output by mid-2026—six months ahead of schedule. The move responds to unprecedented demand from NVIDIA, AMD, and custom AI chip designers seeking secure, U.S.-based advanced packaging and manufacturing.
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